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SCI-E Article

A method for wafer assignment in semiconductor wafer fabrication considering both quality and produc
성명 이동희()
소속 산업융합학부 산업융합학부
캠퍼스
우수선정주 2019년 10월 4째주
Author 이동희 (Coll Interdisciplinary Ind Studies) corresponding author; Kim, Kwang-Jae (Coll Interdisciplinary Ind Studies);
Corresponding Author Info Lee, DH (reprint author), Hanyang Univ, Coll Interdisciplinary Ind Studies, 222 Wangsimni Ro, Seoul 04763, South Korea.
E-mail 이메일 아이콘dh@hanyang.ac.kr
Document Type Article
Source JOURNAL OF MANUFACTURING SYSTEMS Volume:52 Issue: Pages:23-31 Published:2019
Times Cited 0
External Information http://dx.doi.org/10.1016/j.jmsy.2019.05.006
Abstract In the semiconductor wafer fabrication process, wafers go through a series of sequential process steps. Typically, each process step has several machines, and the wafers are assigned to one whenever they enter the process step. When assigning wafers to machines, it is important to consider both the quality and productivity perspectives. Major semiconductor companies in Korea have recently implemented a wafer assignment system to improve wafer yield, a critical measure for semiconductor quality. This system, however, does not consider the productivity perspective. This paper presents a systematic method for assigning wafers to maximize the wafer yield while satisfying a predetermined target level of productivity. A simple hypothetical example is presented to illustrate the method.
Web of Science Categories Engineering, Industrial; Engineering, Manufacturing; Operations Research & Management Science
Funding National Research Foundation of KoreaNational Research Foundation of Korea [2016K2A9A2A11938390]; Hanyang University
Language English
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